Federal Highway Administration
1200 New Jersey Ave. S.E.
Washington, D.C. 20590
December 6, 2007
In Reply Refer To: HSSD/WZ-261
Mr. Shawn Kim
HUB International Trade/ACOPAN
210-1103, Samsan 2 Town, Samsan 2 Dong
Bupyeong-Gu, Incheon, 403-909
Dear Mr. Kim:
Thank you for your correspondence requesting the Federal Highway Administration’s (FHWA) acceptance of Acopan 2 mm, 3 mm, and 4 mm thick sign substrate. Accompanying your letter were product specification certificates and samples of the substrate. You requested acceptance of Acopan as a sign substrate for use with accepted sign stands on the National Highway System (NHS) under the provisions of the National Cooperative Highway Research Program (NCHRP) Report 350 “Recommended Procedures for the Safety Performance Evaluation of Highway Features.”
Upon request, you provided samples of the Acopan sign substrate to the FHWA and a copy of the product specifications. The Acopan product specifications are enclosed. The Acopan sign substrate is a brand name of aluminum laminate material. The material properties of the 2 mm, 3 mm, and 4 mm Acopan substrate are nearly identical and considered to be equivalent to other previously accepted 2 mm, 3 mm, and 4 mm aluminum laminate sign substrates. Our records indicate that 2 mm, 3 mm, and 4 mm aluminum laminate signs have been successfully crash tested on portable stands made by a number of manufacturers and are limited to use on the tested and accepted stands. Therefore, the FHWA accepts the use of Acopan 2 mm, 3 mm, and 4 mm aluminum laminate sign substrates for use on the NHS under the range of conditions that equivalent materials have been tested and accepted, when proposed by a State.
Please note the following standard provisions that apply to the FHWA letters of acceptance:
This acceptance letter shall not be construed as authorization or consent by the FHWA to use, manufacture, or sell any patented device for which the applicant is not the patent holder. The acceptance letter is limited to the crashworthiness characteristics of the candidate device, and the FHWA is neither prepared nor required to become involved in issues concerning patent law. Patent issues, if any, are to be resolved by the applicant.
George E. Rice, Jr.
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